Products
- 世界首个wafer scale full automated imprinting process wafer load/unload,coating,imprinting工程自动化
- 通过实现自动化确保批量生产:error最小化及污染最小化
- 通过可重复使用的mold节约CoC
- 与Stepper相比,throughput的投资费用较低及维护费用显见(CoO)
- 从数十nm级超微模式到um级超微模式实现
- 在hole、pillar、wall、trench等大部分模式中防止air void不良及确保高模式复制率
- 拥有3D lens、lenticular等一般photo工艺无法实现的图案的轻松生产能力
- 多种基板的可适用性(glass,、wafer、film)
- 多种基板尺寸适用性(4inch ~ 8inch)
- 世界最高水平的精密残膜控制能力:实现wafer scale均匀残膜并确保再现性
| Imprinting Process |
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| 设备组件 | |
| Full Automated Imprinter |
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| Mold Imprinter |
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| Auto Imprinter |
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| Manual Imprinter |
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| Gigalane NANO-IMPRINTER |
CITUS 6000FA |
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| Fully automatic Imprinter | |
| Overview & Performance |
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| Gigalane NANO-IMPRINTER |
CITUS 6000M for Mold | CITUS 6000R | CITUS 6000SA |
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| Mold Imprinter | Auto Imprinter | Manual Imprinter | |
| Overview |
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| Performance |
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| Nano pattern : WGP |
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| Nano pattern : pillar array |
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| Micro pattern : hole array |
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| Micro lens array : Si wafer |
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| Micro trench line | ![]() |
| Various imprinted patterns |
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