Semiconductor & MEMS

As the 4th Industrial Revolution will be led by robots, IoTs, biofields, smart cars, etc. it is is demanding a smoother storing and processing of data, the performance improvement of the semiconductors, and specialized semiconductor technology will be a crucial factor. To unify the strength, processing, and facilitating ability of the data into a chip, a patterning technology from nano to micro is required that can connect memory, logic, MEMS sensors, etc. as one.

Related Products
Deep Si Etcher
  • - 6inch-12inch Deep Silicon Etcher
  • - Shallow & Deep Si Trench, TSV(Through Si Via), Si Thinning & Sawing
  • - Cycle & non-Cycle Process available
  • - aspect Ratio. ~ 60:1
  • - Uniformity, < ±5%
  • - Metal Contamination 5X1010ea/cm2
  • - Damage-free, HF/LF Dual Bias (HF Bias Optional)
  • - Surface Roughness, min. 3nm
  • - Undercut-free, Notching-free
  • - Loading Effect Control
Applied Device and Process Capability
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