Features
- Dual ICP source optimized for plasma stability
Through formation of stable plasma we assure uniform reproducible processing
- Various chucks provided according to wafer size and materials
High-resistant ESC, low-resistant ESC, monopolar ESC, bipolar ESC, mechanical chuck
- Specialized features available
Ramping(up, down) of recipe tuning factors available for etching
Exceptional selectivity and strong pulsing function for effective etching
Process reservation service provided to economize time on research and mass production - Combination of VDS and ashing chamber made with remote plasma is available
In order to prevent corrosion H2O vapor function and photoresist removal after metal processing is available
Provide various platforms
- Neos-MAXIS200L
- NeoGEN-MAXIS200L
- NeoGENII-MAXIS200L
- Neos-MAXIS200H
- NeoGEN-MAXIS200H
- NeoGENII-MAXIS200H
- Neos-MAXIS300H
- NeoGENIII-MAXIS300H
- NeoGENIII-MAXIS300T
Process Data by Materials
| Quartz |  |
|---|---|
| Aluminum |  |
| GaAs |  |
| SiC |  |
| GaN |  |
| AlGaInP |  |
| InP |  |
