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DRIE ETCHER

DRIE is a key etching equipment to make the diverse sensors, devices and advanced packages for the 4th industrial revolution. It should have specific performances such as a very high etch rate and good etch uniformity.

Gigalane's DRIE Etcher is used in various Si etching processing such as MEMS, TSV, Si thinning and demonstrates outstanding selectivity, uniformity, and speedy etching.
Features
Provide various platforms
  • Neos-MAXIS200D
  • NeoGEN-MAXIS200D
  • NeoGENII-MAXIS200D
  • NeoGENIII-MAXIS300D
Process Data
Cycle process
Non-Cycle process
Product