DRIE is a key etching equipment to make the diverse sensors, devices and advanced packages for the 4th industrial revolution. It should have specific performances such as a very high etch rate and good etch uniformity.
Gigalane's DRIE Etcher is used in various Si etching processing such as MEMS, TSV, Si thinning and demonstrates outstanding selectivity, uniformity, and speedy etching.
Features
- Dual ICP Source for high density plasma
Forms high density plasma and provides stable uniformity
- Exhaust vessel ring structure specialized for uniformity
Exhaust vessel ring is a specialized structure which improves uniformity that varies according to open ratio
- Uses fast response MFC
Use of MEMS structured MFC optimized in cycle process enables faster and shorter cycle, and it is effective in gaining smooth sidewall.
- Specialized features available
Ramping(up, down) of recipe tuning factors available for etching
Exceptional selectivity and strong pulsing function for effective etching
Process reservation service provided to economize time on research and mass production
Provide various platforms
- Neos-MAXIS200D
- NeoGEN-MAXIS200D
- NeoGENII-MAXIS200D
- NeoGENIII-MAXIS300D
Process Data
| Cycle process |  |
|---|---|
| Non-Cycle process |  |
