Features
- CCT type equipment for stable operation
CCT type plasma source which holds high energy particles(convenient in etching solid substances)
Low maintenance fee, outstanding stability & mass-producibility - Flexible processing allows control of gas center and edge ratio
Use of FRC(Flow ration controller) facilitates ratio control of mixed gas center and edge ratio for uniformity
- Dual He structure
Independent control of center and back HE of the edge improves uniformity
- Specialized features available
Ramping(up, down) of recipe tuning factors available for high aspect ratio structure
Exceptional selectivity and strong pulsing function for effective etching are available
Process reservation service is provided to economize time on research and mass production
Provide various platforms
- NeoS-ADF200
- NeoGEN-ADF200
- NeoGENII-ADF200
Process Data
| Oxide |  |
|---|---|
| ACL |  |
